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Tantalum Target

Description

Tantalum targets, also known as tantalum sputtering targets, provide consistent and reproducible process performance with high thickness uniformity. The elimination of texture banding during fabrication produces a uniform microstructure, which delivers improved early-life stability and consistent-through-life sputter performance.
For tantalum target, we focus on to offer our customers with high purities ranging from 3N to 5N, fine and uniform grain size, elimination of strong texture banding, and early target life size stability.
Our tantalum targets' metallic impurities and gaseous impurities have been measured by known authorities around the world.
Besides, we also offer program of recycling reclaimed scrap targets.

Application

Featuring excellent corrosion resistance, high temperature strength and good biocompatibility, tantalum target is used for lots of thin film applications such as a diffusion barrier material, memory devices, a gate electrode in MOSFET devices, a protective coating on print head devices and barrier metal for copper wiring device.

Chemical Composition of Tantalum Target


Chemistry ppm
Description Chief component Impurities maximum
Ta Nb Fe Si Ni W Mo Ti O C H N
Ta1 Remainder 300 40 30 20 40 40 20 150 40 15 20
Ta2 Remainder 800 100 100 50 200 200 50 200 100 15 100
TaNb3 Remainder <35000 100 100 50 200 200 50 200 100 15 100
TaNb20 Remainder 170000- 230000 100 100 50 200 200 50 200 100 15 100
Ta2.5W Remainder 400 50 30 20 30000 60 20 150 50 15 60
Ta10W Remainder 400 50 30 20 110000 60 20 150 50 15 60

Package and Transportation

We pack tantalum target in plywood case and send them by ocean or air.